About Us

We have a solid technical foundation and a reliable team
that places Quality, Technology, and Service at the core of their guiding principles.

Shenzhen Dyan Precision Technology Company Limited

A private firm, concentrates in highly precision grinding, lapping and CMP polishing equipment. Today, Dyan has well developed core technologies of the professions what are our basis and courage to interact with customers, academic institutions and investors.

At the moment

Our Might Is Growing With Each Passing Moment

Each passing year, we surpass our own limits and exceed our previous accomplishments.

207
Production Employees
13000
Square-Meter Plant
31
Percent R&D Expenditure
27
Acquired Patents
Nowadays

We Look Towards the Future

Today, Dyan has taken a step forward to the world market.
Let the time bear witness to our ascent towards grandeur, fortitude, and expansiveness.

FAQs

View commonly asked questions from individuals.

Find Out Your Solution

Discover the most suitable equipment for your needs.

Play Video

Find Out Your Equipment

Dyan's machine is engineered to optimize the critical process of surface abrasion with exceptional precision. Its advanced features contribute to the reliability and performance of semiconductor devices. 

Our company history and facts

With each project, we infuse passion and precision, striving to reveal brilliance that stands as a testament to our commitment to excellence. Join us in reimagining surfaces and embracing the artistry of refinement.

Find Out Wafer Grinding Solution

With a genuine passion for perfecting surfaces, we infuse artistry into every aspect of our work, utilizing advanced equipment and creative innovation in polishing and grinding.

Play Video

Design & development process demonstration

Experience our innovative journey: From visionary concepts and meticulous planning to refined prototypes, our 'Design & Development Process Demonstration' is a testament to creativity meeting excellence.

Find Out Your Solution

With a genuine passion for perfecting surfaces, we infuse artistry into every aspect of our work, utilizing advanced equipment and creative innovation in polishing and grinding.

Wafer Grinder

Dyan's wafer grinder is engineered to optimize the critical process of wafer thinning with exceptional precision. Its advanced features ensure uniform wafer thickness, contributing to the reliability and performance of semiconductor devices. 

CONTACT US