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Semiconductor
We excel in providing professional grinding, and CMP solutions, specializing in applications crucial for the semiconductor industry. Our expertise includes wafer thinning, surface preparation for lithography, edge beveling (grinding), back grinding of wafers, and Chemical Mechanical Planarization (CMP). We are also adept at achieving mirror-finish polishing, relieving stress in wafers, preparing substrates for epitaxial growth, and die preparation post-dicing. Our proficiency ensures high-quality and precision in every step, essential for meeting the advanced demands of semiconductor manufacturing.
Thinning and Planarization
After the initial slicing of silicon ingots to produce semiconductor wafers, these wafers are often too thick for practical use. Lapping and grinding are critical for subsequent photolithographic processes and for efficient heat dissipation in the final device.
Back Grinding
Post circuit fabrication, the backside of the wafer is ground to achieve the desired final thickness and to improve the thermal and mechanical properties of the wafer.
Chemical Mechanical Planarization (CMP)
This is a hybrid technique that combines chemical etching with mechanical polishing. CMP is essential in smoothing the wafer's surface between various fabrication steps.
Preparation (Photomask) for Lithography
Before a wafer undergoes lithographic processes, it is essential to have a perfectly flat and smooth surface. Any irregularities can lead to defects in the circuit patterns. Lapping and polishing are used to achieve these ultra-smooth surfaces.
Preparation for Epitaxial Growth
For advanced semiconductor devices, epitaxial layers are grown on the substrate. The substrate surface must be flawlessly smooth and clean, which is achieved through precision polishing.
Preparation for Die
After the wafer fabrication, individual dies are separated (dicing). The die surfaces are often polished to ensure good adhesion for packaging materials and to remove any damage caused by the dicing process.
Preparation for TSV
Thinner wafers can reduce the length of the vias for 3D integration, which in turn can reduce resistance and capacitance, improving overall electrical performance.
Stress Relieving
After various high-temperature processes, wafers can develop internal stresses. Fine grinding and CMP can relieve these stresses, reducing the risk of wafer warpage or breakage.
Edge Beveling (Grinding)
The edges of the wafers are beveled and polished to remove any chips or cracks that could lead to wafer breakage during processing. This also minimizes the risk of contaminants that can affect the wafer's integrity.
Related Equipment
Ceramic Substrate Finishing
Grinding and Polishing ceramic substrates used in electronic packaging to ensure flatness and surface quality, which is vital for mounting electronic components.
| Industry | Product |
| Wafer & Substrate | AlN GaAs GaN Ge Ge-Si Glass InP InSb Quartz Sapphire Si SiC ZnO |
| Semiconductor Device | Detector Device Filter Device Laser Device Micro LED Mini LED Optical Communication Device Power Device RF Device Silicon Photonic Devices |
| MEMS | Accelerometer Gyroscope Humidity Sensor Microphone Optical Sensor Pressure Sensor |
| Advanced Packaging | Fan-out SIP TSV |
| Flat Optics | Holographic Slide Glass Slide Optical Lens Optical Reflector |
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