DYW420 Screen Buffing Polisher

Circuited SiC Wafer GrindingBrush buffing polishing has become the most commonly used process for polishing smartphone screens in the past decade. Additionally, this technique is also applied to the edge polishing of optical products, smart watch screen and other arch-edge products. It has gained favor among many manufacturers due to the durability of its polishing brush, which last significantly longer than those used in other processes at the same efficiency.

Accessible Roughness (LCD) Ra. 0.01 μm
Processable Contour Quarter & Half Circle
Orange Peel Effect Total 2%

Brief Introduction

The Screen Buffing system distinguishes itself from others. It's particularly effective for buffing smartphone screens and back plates, as well as removing scratches. Though it employs the same abrasives and slurry as flat polishing, its unique feature lies in the distinct plate patterns bristling with many hair-like abrasives. This series shines when it comes to polishing curved surfaces. To achieve the desired arch accuracy, such as roundness, the workpiece must adhere to specified tolerance levels before the process begins.

Features
  • Quick Loading & Unloading
  • Curved Edge Polishing ◉
  • Dual Polishing Sectors (DYW42010)
  • Water Proof by UV Glue ◉
  • Polishing Slurry Auto Supply System
  • Brush Buffing Polishing ◉

Engineering Intent

With the widespread adoption of curved edge designs for screens and frames in modern smart devices, we have adjusted our processing formula and updated our polishing pads to buffing brush forms to accommodate this change. This allows the buffing brush to specifically target and finely polish half-circular and quarter-circular arcs. Utilizing the brush's forward and reverse functions, in conjunction with our processing formula, effectively reduces the occurrence of orange peel effects, ensuring a high-quality polishing result.

Parameters
System Model DYW4201 DYW42010
Buffing Brush Diameter (mm) ∅ 420 ∅ 420
Number of Buffing Brush 1 4
Worktable Diameter (mm) ∅ 550 ∅ 418
Number of Worktable 1 10
Turntable Diameter (mm) - ∅ 1150
Load Capacity *iPhone 13 Pro Max 8 50
Brush Rotation Rate (rpm) *ccw & cw 5 - 250 5 - 250
Worktable Rotation Rate (rpm) *ccw & cw 5 - 120 5 - 120
Turntable Rotation Rate (rpm) - 0 - 20
Y-axis Stroke (mm) - 1260
Z-axis Stroke (mm) 205 240
Total Power (kW) 5.2 21
Weight (kgf) 450 2700
Dimension (L×W×H) (mm) 700 × 960 × 1820 2520 × 1960 × 2230
Key Facts

1. How It Works

The buffing polisher doesn't rely on applying pressure to achieve a polished finish. Instead, it uses high-speed rotation to swiftly glide over the surface of the workpiece. When in use, the brush spins towards worktable, perfectly molding to and covering the curves of workpieces. During the process, the polishing liquid is pre-fed through the brush to the polishing area. Then, both the brush and the worktable undergo simultaneous forward and reverse, as well as concurrent rotational movements. This approach enhances the efficiency of the polishing process and reduces the occurrence of orange peel texture.

Quarter-Circle Buffing Diagram

Half-Circle Buffing Diagram

2. Clamping

The method of clamping the workpiece is primarily determined by the workpiece's characteristics. For polishing bare screens, vacuum is generally used, while for repairing entire smartphones, the phone is placed in an independent fixture and sealed with blue UV glue before being placed on the worktable. At the same time, the angle of the product's curved edge also determines the clamping method: if it's a quarter-circle arc (commonly known as 2.5D), the product is placed flat on the worktable. If it's a half-circular arc (known as 3D), the product needs to be positioned on its side so the brush can fully cover the arc edge. Typically, half-circular arc products require four processes to polish all four sides.

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Dyan Precision Technology situated in the innovative city Shenzhen, occupies a production plant area of approximately 13,000 square meters and specializes in the field of grinding, lapping and polishing technology. With a focus on research and development, production, and sales, the company offers a diverse range of high-precision equipment such as flat lapping and polishing equipment, wafer grinder, wax bonder, screen polisher, and associated consumables. These products find extensive application in the precise processing of mechanical seals, semiconductor fabrication, smart phone, optics, aerospace, aviation, automotive, LED technology, metrology, solar enegery, nuclear energy, jewellary, and various other industries.

*Reminder: we only offer once free and limited sampling. The expenses of delivery and prourement of the sample entity are to be covered by the sender.

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Applicability

Process

Industry

Product

Buffing
Polishing

Electronics

Smart Phone Screen

Smart Phone Middle Frame

Smart Phone Back Plate

Smart Watch Screen

Smart Watch Middle Frame

Sampling Showcase

Sample
Thumbnail

Sample
Application

Major
Material

Applied
Machining

Edge Circle
(Quarter/Half)

Roughness
(Sa/nm)

Orange Peel
Effect

Defect Dia.
(μm)

Back Plate

Aluminum
Alloy

Buffing

Half Circle

14.915

1%

≤ 0.1

Back Plate

Zirconia

Buffing
Polishing

Half Circle

11.876

1%

≤ 0.1

Back Plate

Zirconia

Buffing

Quarter Circle

18.266

2%

≤ 0.1

Touch Screen
Assembly

GFF Glass

Buffing

Quarter Circle

15.134

0.5%

≤ 0.1

Outter Screen

GFF Glass

Buffing
Polishing

Quarter Circle

17.485

0.5%

≤ 0.1

Outter Screen

PMMA

Buffing

Quarter Circle

12.279

Not Allowed

≤ 0.1

Smart Phone
Middle Frame

Aluminum
Alloy

Lapping
Buffing
Polishing

Quarter Circle
*corner

42.610

Not Specified

Not Specified

Smart Watch
Middle Frame

Aluminum
Alloy

Corase Buffing

Half Circle

251.651

Not Specified

Not Specified