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DYG3000 Full Automatic Wafer Grinder

DYC2000 Full Automatic Edge Grinder

Silicon Wafer Edge GrindingDyan is dedicated to manufacturing related accessories for wafer grinding, including Full Automatic Edge Grinder, Wax Bonding Machine and Debonding Machine, as well as UV Tape Mounter and Demounter. These machines enable our wafer grinders to integrate smoothly with other stages of production, providing our customers with a comprehensive solution that reduces both time and financial investment.

Min. Thickness (4-inch Sapphire) 300 μm
Accessible Roundness (4-inch Sapphire) <10 μm
Angularity Tolerance (4-inch Sapphire) ±0.1 degree
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Brief Introduction

The DYC Edge Grinder adopts a dry-in-dry-out processing mode, integrating a range of advanced technologies such as CCD defect analysis system, dual-fluid wafer cleaner, sensor cassette docks, and orientation grinding system. The equipment additionally features four cassette docks and one defect wafer dock specifically designed for the segregation of defective and non-defective wafers. Such design minimizes the frequency of cassette loading procedure. In comparison, the mechanical performance and structural logic design of the equipment contribute to surpassing the efficiency and accuracy of most comparable machines within the market. 

Specifications
Key Facts
Sampling
Features
  • Dry-In-Dry-Out Process
  • CCD Orientation Aligner ◉
  • Defect Inspection System ◉
  • Sensorial Cassette I/O Dock
  • Dual-Fluid Spray Wafer Cleaner
  • High Precision Docking Robot
  • Variable Orientation Grinding ◉

Engineering Intent

Wafer edge grinding is a crucial step in the semiconductor manufacturing process. It removes the sharp edges of wafer, preventing potential damage to the delicate circuitry during subsequent processing steps. This process also ensures consistent uniformity of wafer’s edge, which are critical for optimal device performance. Additionally, edge grinding can create specific edge profiles to improve handling and integration with packaging technologies.

Work Flow
  • The Docking Robot grips a wafer from the Cassette and places it on the CCD Aligner for centralizing and thickness inspection.
  • The Mount Robot places the wafer on the Vacuum Table.
  • The Grinding Wheel grinds the edges and orientation of the wafer.
  • The Mounting Robot removes the wafer from the grinding sector and places it on the Wafer Cleaner.
  • The Mounting Robot removes the dried wafer from the cleaning sector and places it on the CCD Aligner for roundness inspection.
  • The Docking Robot places the inspected wafer in the Cassette or places defective wafers in the Defect Cassette.
Parameters
System Model DYC2100 DYC2150 DYC2200
Max. Wafer Diameter (inch) 4 6 8
Processable Orientation *double sided P100/111     N100/111     V-Notch
Grinding Wheel Diameter (mm) ∅ 205 ∅ 205 ∅ 205
Grinding Spindle Power (kW) 1 1 1.5
Notch Grinding Spindle Power (kW) 0.25 0.25 0.25
Grinding Rotation Rate (rpm) 500 - 3000 500 - 3000 500 - 3000
Table Rotation Rate (rpm) 0 - 400 0 - 400 0 - 400
X-aixs Stroke (mm) 600 600 600
Y-aixs Stroke (mm) 100 150 200
Z-aixs Stroke (mm) 50 50 50
Feed Rate (μm/s) 0.5 - 1000 0.5 - 1000 0.5 - 1000
Thickness Gauge Resolution (μm) 0.5 0.5 0.5
Total Power (kW) 5 5 5.5
Weight (kgf) 1000 1100 1300
Dimension (L×W×H) (mm) 2000 × 1150 × 1950 2000 × 1150 × 1950 2000 × 1150 × 1950
Key Facts

1. Why is Edge Grinding (Beveling) Important

  • Prevent wafer edge chipping. During the manufacturing of wafers, they are often impacted by robot arms, which could cause edge breakage(chipping) and form areas of stress concentration. These areas of stress concentration could continuously release contaminating particles during usage, thereby affecting the product yield.
  • Prevent thermal stress concentration. Wafers undergo numerous high-temperature processes during usage, such as oxidation and diffusion. When the thermal stress generated by these processes exceeds the strength of the wafer lattice, dislocation and stacking faults will occur. Edge grinding can exactly avoid these defects at the edge of the wafer.
  • Increase the flatness of the epitaxial layer and photoresist layer at the edge of the wafer. In epitaxial processes, the growth rate of the sharp angle region is higher than that of the plane. Therefore, using an unrounded wafer is likely to produce protrusions at the edge. Similarly, when using a spin coater to apply photoresist, the photoresist solution may accumulate at the edge of the wafer, affecting the accuracy of mask alignment.

Photoresist Flowing Diagram

2. CCD Aligner and Inspector

The equipment features a high-precision CCD Visualized Inspection System, utilized for both alignment and detecting defects. Additionally, a thickness gauge is incorporated to measure the wafer's thickness during the alignment phase. To accurately determine the feed position and the chamfering wheel's angle, the system calculates the wheel's trajectory. This calculation involves a mathematical model that takes into account the numerical values related to the wafer's surface pattern and thickness, ensuring precise chamfering.

After processing, the system will inspect the wafer for roundness and the presence of any chipping at the edges. It will then separate the qualified and defected wafers, placing them into designated wafer cassettes.

CCD Inspection Diagram

3. Notch and Orientation Grinding

The orientation of a wafer is a fundamental aspect of semiconductor manufacturing, affecting everything from the basic electrical properties of the devices created to the robustness and efficacy of the manufacturing process itself. Selecting the appropriate orientation is a critical decision that can significantly influence the success of the semiconductor devices produced.

The DYC Series is capable of chamfering the orientation of wafers, with its grinding bit powered by an independent grinding spindle. This allows it to accommodate wafers with various orientations, including V-Notch, P (100/111) type, N (100/111) type, and others. This versatility ensures that the equipment can process a wide range of wafer types, catering to the specific requirements of different semiconductor devices.

Notch Grinding Bit

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Dyan Precision Technology situated in the innovative city Shenzhen, occupies a production plant area of approximately 13,000 square meters and specializes in the field of grinding, lapping and polishing technology. With a focus on research and development, production, and sales, the company offers a diverse range of high-precision equipment such as flat lapping and polishing equipment, wafer grinder, wax bonder, screen polisher, and associated consumables. These products find extensive application in the precise processing of mechanical seals, semiconductor fabrication, smart phone, optics, aerospace, aviation, automotive, LED technology, metrology, solar enegery, nuclear energy, jewellary, and various other industries.
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*Reminder: we only offer once free and limited sampling. The expenses of delivery and prourement of the sample entity are to be covered by the sender.

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Applicability

Process

Industry

Product

Grinding
and CMP

Wafer Substrate

AIN

GaAs

GaN

Ge

Ge-Si

Glass

InP

InSb

Quartz

Sapphire

Si

SiC

ZnO

Semiconductor
Device

Detector Device

Filter Device

Laser Device

Micro LED

Mini LED

Optical Communication Device

Power Device

RF Device

Silicon Photonic Device

MEMS

Accelerometer

Gyroscope

Humidity Sensor

Microphone

Optical Sensor

Pressure Sensor

Advanced Packaging

Fan-out

SIP

TSV

Flat Optics

Holographic Slide

Glass Slide

Optical Lens

Optical Reflector
Sampling Showcase

Sample
Thumbnail

Major
Material

Dimension
(inch)

Applied
Machining

Thickness
(μm)

TTV
(μm)

Roughness
(Sa/nm)

Flatness
(μm)

Silicon
Carbide

6

Coarse Grinding
Fine Grinding

120

2.472

2.404

1.518

Silicon
Carbide

6

Coarse Grinding
Fine Grinding
CMP

 150

2.643

0.745

1.343

Gallium
Nitride

4

Coarse Grinding
Fine Grinding
CMP

300

2.181

1.163

1.089

Germanium

4

Coarse Grinding
Fine Grinding
CMP

145

2.205

0.856

1.273

Sapphire

4

Coarse Grinding
Fine Grinding
CMP

220

2.315

0.933

1.148

Gallium
Arsenide

4

Coarse Grinding
Fine Grinding

60

2.240

8.065

1.928

Silicon

12

Coarse Grinding
Fine Grinding

75

2.782

10.065

1.455

Piezoelectric
Ceramic

2

Coarse Grinding

50

1.651

32.468

0.843

Solar Wafer

8.839

Coarse Grinding

100

3.188

13.427

2.212