DYG2000 Full Automatic Wafer Grinder
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DYW420 Screen Buffing Polisher

DYG1000 Semi Automatic Wafer Grinder

Circuited SiC Wafer GrindingPrecision and stability are the essential features of Dyan’s wafer grinders, which can be attributed to our extensive experience and advanced technologies. Building upon this foundation, we have made targeted upgrades to the grinding process for new wafer materials, such as gallium nitride, silicon carbide, and silicon nitride.

Accessible TTV (6-inch SiC) 2.8 μm
Accessible Thickness (6-inch SiC) 60 μm
Accessible Roughness (SiC Fine Grinding) Sa. 0.6 nm
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Brief Introduction

The Semi-Automatic Grinding Machine series features a more compact body design and is typically used in laboratory and light production line scenarios. The grinding center serves as the core unit for all grinder series, employing a frame made of granite material. Coupled with our independently developed high-power air bearing spindle and unique stroke mechanism, the machine can deliver high-quality surface results and precision.

Specifications
Key Facts
Sampling
Features
  • Air Bearing Grinding Spindle ◉
  • Granite Base and Column
  • Microporous Vacuum Table ◉
  • In-Process Thickness Gauge ◉
  • DIW and CDA Sprayers
  • Built-in Acoustic Emission (AE) Sensor ◉

Engineering Intent

The wafer grinder actively reduces the thickness of the semiconductor wafer in the fabrication process. This is done to achieve better heat dissipation and increase the integration density of the devices on the wafer. Moreover, the wafer grinder effectively produces a smooth, flat surface for subsequent procedures by removing surplus material from the wafer surface. This particular step is crucial in the fabrication of integrated circuits and other semiconductor devices.

Parameters
System ModelDYG1100DYG1200DYG1300
Max. Wafer Diameter (inch)4812
Grinding Wheel Diameter (mm)∅ 209∅ 209/254∅ 312
Grinding Spindle Power (kW)5.57.511
Grinding Rotation Rate (rpm) *ccw & cw500 - 3000500 - 3500500 - 4000
Table Rotation Rate (rpm) *ccw & cw10 - 45010 - 45010 - 450
Z-aixs Stroke (mm)100100100
Z-axis Feed Rate (μm/s)0.1 - 800.1 - 800.1 - 80
Thickness Gauge Resolution (μm) *optional0.10.10.1
Acoustic Emission Signal (kHz) *optional20 - 100020 - 100020 - 1000
Total Power (kW)81114
Weight (kgf)170017601920
Dimension (L×W×H) (mm)1150 × 1220 × 19801150 × 1220 × 19801150 × 1220 × 1980
Key Facts

1. Air Bearing Spindle

The grinding spindle's bearing leverages dry and clean air funneled through microporous layers to support the rotor shaft against the stator, enabling fast and smooth rotation. This design eliminates any physical contact during the spindle's spin. Known as "Microporous Air Bearings," this type of bearing offers unmatched durability and stability for the spindle. 

Following a dynamic balance adjustment, Dyan's air bearing spindle achieves extremely low amplitude rotation at 3000 RPM, with radial pulsation under 0.1 micron.

Microporous Air Bearing

2. Worktable and Vacuum

The worktable is driven by a high-resolution servo motor capable of rotating, featuring an automatic homing function. For models equipped with a contact thickness gauge, the sealing ring of the vacuum worktable is made of ceramic and serves as the benchmark reference for the thickness gauge.

The vacuum clamping adapts microporous ceramic as the medium which can be selectively equipped with single-size or universal-size and includes a blow-back function, allowing for the safe removal of wafers and expulsion of impurities from within the ceramic pores. Universal vacuum table can accommodate wafers ranging from 2 inches to 12 inches on the same table by embedding adsorption areas of various sizes. Additionally, custom-designed vacuum table is provided for irregularly shaped planes.

Universal Vacuum Table

3. Difference of In-process Thickness Gauges

A high-precision, in-process thickness gauge (IPG) is a crucial component in grinders, directly impacting the consistency of grinding precision. It also offers the significant benefit of providing precise offset measurements for the grinding wheel's consumption. Dyan provides two sorts of in-process thickness gauges available as options for monitoring wafer thickness under various grinding conditions.

  • The Contact Gauge features two precision probes that maintain constant contact with the wafer and the benchmark on worktable during inspection. The difference in height between the two points being measured indicates the wafer's thickness (or the thickness including the UV tape). This gauge may leave a barely visible circular imprint, which can be removed in the fine grinding process.
  • The Non-Contact Gauge employs infrared technology to assess the wafer's true thickness by analyzing the volume of ray absorption, reflection, and dispersion. This method does not include the thickness of the UV film or adhesive in its measurements. It is essential for finish polishing and ultra-thin grinding to ensure the safety of the wafer.

IPG Measurement Range Diagram

4. Built-in Acoustic Emission Sensor

A built-in Acoustic Emission (AE) Sensor in a grinding spindle is a sophisticated in-process monitoring tool that detects high-frequency sounds produced during the grinding process. These sounds are converted into electrical signals for analysis, providing valuable insights into the grinding conditions, such as the interaction between the grinding wheel and workpiece, and the presence of material defects or wheel dullness. This real-time feedback enables on-the-fly process optimization, improving surface finish quality, reducing tool wear, and enhancing efficiency.

Additionally, the AE sensor aids in preventive maintenance by predicting equipment failures, thus minimizing downtime and extending the lifespan of grinding machinery. This integration not only optimizes the grinding efficiency and surface finish but also supports predictive maintenance, reducing downtime and extending the lifespan of the equipment.

Built-in AE Sensor 

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Dyan Precision Technology situated in the innovative city Shenzhen, occupies a production plant area of approximately 13,000 square meters and specializes in the field of grinding, lapping and polishing technology. With a focus on research and development, production, and sales, the company offers a diverse range of high-precision equipment such as flat lapping and polishing equipment, wafer grinder, wax bonder, screen polisher, and associated consumables. These products find extensive application in the precise processing of mechanical seals, semiconductor fabrication, smart phone, optics, aerospace, aviation, automotive, LED technology, metrology, solar enegery, nuclear energy, jewellary, and various other industries.
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*Reminder: we only offer once free and limited sampling. The expenses of delivery and prourement of the sample entity are to be covered by the sender.

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Applicability

Process

Industry

Product

Grinding
and CMP

Wafer Substrate

AIN

GaAs

GaN

Ge

Ge-Si

Glass

InP

InSb

Quartz

Sapphire

Si

SiC

ZnO

Semiconductor
Device

Detector Device

Filter Device

Laser Device

Micro LED

Mini LED

Optical Communication Device

Power Device

RF Device

Silicon Photonic Device

MEMS

Accelerometer

Gyroscope

Humidity Sensor

Microphone

Optical Sensor

Pressure Sensor

Advanced Packaging

Fan-out

SIP

TSV

Flat Optics

Holographic Slide

Glass Slide

Optical Lens

Optical Reflector
Sampling Showcase

Sample
Thumbnail

Major
Material

Dimension
(inch)

Applied
Machining

Thickness
(μm)

TTV
(μm)

Roughness
(Sa/nm)

Flatness
(μm)

Silicon
Carbide

6

Coarse Grinding
Fine Grinding

120

2.472

2.404

1.518

Silicon
Carbide

6

Coarse Grinding
Fine Grinding
CMP

 150

2.643

0.745

1.343

Gallium
Nitride

4

Coarse Grinding
Fine Grinding
CMP

300

2.181

1.163

1.089

Germanium

4

Coarse Grinding
Fine Grinding
CMP

145

2.205

0.856

1.273

Sapphire

4

Coarse Grinding
Fine Grinding
CMP

220

2.315

0.933

1.148

Gallium
Arsenide

4

Coarse Grinding
Fine Grinding

60

2.240

8.065

1.928

Silicon

12

Coarse Grinding
Fine Grinding

75

2.782

10.065

1.455

Piezoelectric
Ceramic

2

Coarse Grinding

50

1.651

32.468

0.843

Solar Wafer

8.839

Coarse Grinding

100

3.188

13.427

2.212